• Cu/Mo/Cu (CMC) Heat Sink Electronic Packing Sandwish Composite Heat Sink Materials
  • Cu/Mo/Cu (CMC) Heat Sink Electronic Packing Sandwish Composite Heat Sink Materials
  • Cu/Mo/Cu (CMC) Heat Sink Electronic Packing Sandwish Composite Heat Sink Materials
  • Cu/Mo/Cu (CMC) Heat Sink Electronic Packing Sandwish Composite Heat Sink Materials
  • Cu/Mo/Cu (CMC) Heat Sink Electronic Packing Sandwish Composite Heat Sink Materials
  • Cu/Mo/Cu (CMC) Heat Sink Electronic Packing Sandwish Composite Heat Sink Materials

Cu/Mo/Cu (CMC) Heat Sink Electronic Packing Sandwish Composite Heat Sink Materials

Die Casting Machine Type: Customize
Die Casting Method: Customize
Application: Many Aspects
Machining: CNC Machining
Material: Cu/Mo/Cu
Surface Preparation: Customize
Samples:
US$ 10/Piece 1 Piece(Min.Order)
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Diamond Member Since 2008

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Rating: 5.0/5
Manufacturer/Factory, Trading Company

Basic Info.

Model NO.
Customized
Pressure Chamber Structure
Customize
Tolerance Grade
Customize
Casting Surface Quality Level
Customize
Certification
ISO 9001:2015
CMC13/74/13 Density
9.88 g/cm3
Transport Package
Vacuum Packing
Specification
Customized
Trademark
FOTMA
Origin
China
HS Code
854290000
Production Capacity
10000 Pieces/Month

Product Description

 
Cu/Mo/Cu(CMC) Heat Sink
Description:
  Cu/Mo/Cu(CMC) heat sink, also known as CMC alloy, is a sandwich structured and flat-panel composite material. It uses pure molybdenum as the core material, and is covered with pure copper or dispersion strengthened copper on both sides. Besides, copper molybdenum copper heat sink has adjustable coefficient of thermal expansion, high thermal conductivity, and high thermal stability.
  S-CMC is a multi-layered Copper and Molybdenum clad metal, which has an excellent property both low CTE and high thermal conductivity. Its higher thermal conductivity compared to other same kind of materials contributes to highly powered electronic packages.

Cu/Mo/Cu (CMC) Heat Sink Electronic Packing Sandwish Composite Heat Sink Materials

Product Properties:
Grade Density g/cm3 Coefficient of thermal
Expansion ×10-6  (20ºC)
Thermal conductivity W/(M·K)
CMC111 9.32 8.8 305(XY)/250(Z)
CMC121 9.54 7.8 260(XY)/210(Z)
CMC131 9.66 6.8 244(XY)/190(Z)
CMC141 9.75 6 220(XY)/180(Z)
CMC13/74/13 9.88 5.6 200(XY)/170(Z)

Cu/Mo/Cu (CMC) Heat Sink Electronic Packing Sandwish Composite Heat Sink Materials
 
Material Wt%
Molybdenum Content
g/cm3
Density
Thermal conductivity at 25ºC Coefficient of thermal
expansion at 25ºC
S-CMC 5 9.0 362 14.8
10 9.0 335 11.8
13.3 9.1 320 10.9
20 9.2 291 7.4

Cu/Mo/Cu (CMC) Heat Sink Electronic Packing Sandwish Composite Heat Sink Materials
Application:
  Cu/Mo/Cu(CMC) heat sink has similar applications with tungsten copper heat sinks. It can be used as thermal mounting plates, chip carriers for microwave, flanges and frames for RF, laser diode packages, LED packages, BGA packages and GaAs device mounts etc.
  S-CMC heat sink can be used in wireless communication packaging, opto electronics packaging etc.

Product show:
Cu/Mo/Cu (CMC) Heat Sink Electronic Packing Sandwish Composite Heat Sink Materials
Cu/Mo/Cu (CMC) Heat Sink Electronic Packing Sandwish Composite Heat Sink Materials
Cu/Mo/Cu (CMC) Heat Sink Electronic Packing Sandwish Composite Heat Sink Materials
Cu/Mo/Cu (CMC) Heat Sink Electronic Packing Sandwish Composite Heat Sink Materials
Cu/Mo/Cu (CMC) Heat Sink Electronic Packing Sandwish Composite Heat Sink Materials

 

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