Diamond-Copper (D/Cu) Composite Material Diamond-Aluminum (D/Al) Composite Heat Sink

• Customization: Available
• Pressing Speed: Isostatic Pressing
• Suppression Method: Customized
• Model NO.: Customized
• Application: Mechanical Gadgets, Aerospace, Electric Appliances
• Surface Condition: Polished, Electronic Plated
• Density: 3.0-6.0g/Cm³
• Thermal Conductivity: 400-600W/M·K
• Cte: 6-10 Ppm/°C
• Transport Package: Plywood Boxes
• Specification: Customized
• Trademark: FOTMA
• Origin: P. R. China
• HS Code: 81019990
• Production Capacity: 10t/Year
• Package Size: 35.00cm * 25.00cm * 25.00cm
• Package Gross Weight: 10.000kg

Product Description

Product Description

Diamond Composite Materials: The Ultimate Solution for High-Performance Thermal Management

Revolutionizing Heat Dissipation with Diamond-Metal Composites
By integrating synthetic diamond particles into high-thermal-conductivity metal matrices (Ag, Cu, Al) through advanced composite manufacturing, diamond/metal composites achieve an unprecedented combination of ultra-high thermal conductivity and low thermal expansion, making them the next-generation material for high-power electronic packaging and thermal management.

Diamond-Copper (D/Cu) Composite: The Thermal Performance Benchmark
Material Structure
Diamond-Copper Composite (D/Cu) is a matrix composite of synthetic diamond powder and copper alloy. Utilizing premium lab-grown diamonds with intrinsic thermal conductivity of 1,000 W/m·K and near-zero thermal expansion, this material achieves perfect interfacial metallurgical bonding under optimized processing, delivering exceptional thermal and mechanical properties.

Key Advantages

• Unmatched Thermal Performance: Thermal Conductivity: 500-800 W/m·K (adjustable based on diamond-to-copper ratio); Low CTE: 4-8 ppm/°C, precisely matching semiconductor materials (e.g., Si, GaN, SiC) to minimize thermal stress.
• Design Flexibility: Adjustable diamond content (40%-70%) to balance thermal conductivity and CTE for specific applications.
• Surface Engineering: Compatible with Ni/Au plating for hermetic sealing, oxidation resistance, and solder ability.
• Weight Reduction: Density 5.2-6.0 g/cm³, 30% lighter than traditional tungsten-copper (W/Cu) heat sinks.

Diamond-Aluminum (D/Al) Composite: Lightweight Alternative
Material Profile
Similar to D/Cu but with aluminum as the matrix, the Diamond-Aluminum Composite (D/Al) offers even greater weight savings while maintaining competitive thermal performance:

• Thermal Conductivity: 400-600 W/m·K
• CTE: 6-10 ppm/°C
• Density: 3.0-3.5 g/cm³, 40% lighter than D/Cu, ideal for aerospace and portable electronics.

Why Choose D/Al?
Optimized for applications where lightweight design is critical without compromising thermal management efficiency.
 

Product Parameters

 

Property	Diamond-Copper (D/Cu)	Diamond-Aluminum (D/Al)
Thermal Conductivity	500-800 W/m·K	400-600 W/m·K
CTE	4-8 ppm/°C	6-10 ppm/°C
Density	5.2-6.0 g/cm³	3.0-3.5 g/cm³ (lightweight champion)
Ideal Use Cases	High-power lasers, EV power modules	UAVs, satellites, 5G RF devices

 

Applications: Where Diamond Composites Excel

• Power Electronics: IGBT modules, motor controllers, and SiC/GaN device packaging
• Aerospace & Defense: Radar systems, avionics cooling, hypersonic vehicle thermal shields
• Optoelectronics: Laser diodes, LED arrays, fiber-optic transceivers
• Consumer Tech: High-performance CPUs, gaming GPUs, and ultra-thin laptop heat spreaders

 

Technical Superiority

• Precision Interface Bonding: Advanced vacuum hot-pressing ensures robust diamond-metal interfaces for minimal thermal resistance.
• Customizable Formulation: Fine-tune diamond size (50-200 μm), volume fraction, and matrix alloys (Cu, Al, Ag) for mission-specific requirements.
• Reliability: Stable performance under extreme conditions (-200°C to +500°C), withstanding thermal cycling and mechanical shock.

 

Pictures