Product Description
CPC Composite Material: Next-Generation Thermal Management for High-Power Electronics
CPC (Copper-Molybdenum-Copper), a sandwich-structured composite material similar to CMC, was pioneered by Japanese engineers in the early 2000s to address escalating thermal demands in 2G/3G high-power devices. Today, it has emerged as a superior alternative to oxygen-free copper in cutting-edge applications, including Huawei's 5G base station RF module substrates, where our CPC solutions now dominate the supply chain.
Structural Innovation: Precision-Engineered for Excellence
CPC features a molybdenum-copper alloy core (e.g., Mo70Cu30 or Mo50Cu50) , sandwiched between two oxygen-free copper layers. This hybrid design delivers unmatched performance:
- Molybdenum-Copper Core: Optimized alloy ratios (adjustable per requirements) balance thermal and mechanical properties.
- Oxygen-Free Copper Cladding: Ensures high thermal conductivity (>400 W/m·K, exceeding CMC) and flawless electroplating compatibility.
- Anisotropic CTE Control: Unlike CMC (uniform X-Y expansion), CPC's CTE in X/Y axes can be independently tuned by adjusting molybdenum particle deformation within the core-a breakthrough enabling precise stress matching.
Key Competitive Advantages
- Ultra-High Thermal Conductivity
CPC outperforms CMC with ≥15% higher thermal conductivity (up to 400 W/m·K), making it ideal for heat-intensive applications like 5G mm Wave chips and high-density power modules.
- Directional Thermal Expansion Tuning
Customize X/Y-axis CTE (adjustable range: 6-12×10-6/K) via core alloy composition and processing, eliminating thermal mismatches in multi-material assemblies.
- Cost-Effective Stamping Process
Our proprietary manufacturing technology enables high-precision stamping of CPC into complex shapes (heat pipes, finned sinks, multi-post substrates) while reducing production costs by 30% vs. traditional machining methods. Foreign CPC variants lack this capability.
- Military-Grade Reliability
Vacuum hot-pressing ensures interlayer bond strength >120 MPa, validated by 1,500 thermal shock cycles (-65°C to 200°C) without delamination.
Applications: Powering Innovation Across Industries
- 5G/6G Communications: Huawei-certified RF device substrates, phased array antenna cooling plates.
- Advanced Semiconductor Packaging: High-power GPU/CPU heat spreaders, IGBT/DBC substrates.
- New Energy Vehicles: EV motor controllers, onboard charger (OBC) thermal management.
- Aerospace & Defense: Satellite power systems, avionics cooling solutions.
Why Our CPC Stands Out?
- Huawei Trusted Supplier: 100% supply share for 5G base station RF module substrates, with zero defect rate since 2020.
- Rapid Customization: Adjust core ratios (Mo/Cu) and layer thickness within 72 hours.
- Cost Leadership: 20-30% lower lifecycle cost vs. oxygen-free copper, thanks to stamping efficiency and material savings.
The Future of Heat Dissipation Starts Here
As 5G-A and AI drive power densities to unprecedented levels, CPC is rapidly replacing oxygen-free copper in mission-critical thermal interfaces. With our proven expertise and scalable production, we empower clients to conquer thermal bottlenecks while slashing costs.
Product Parameters
| Grade |
Composition |
Density |
Thermal Expansion |
Thermal Conductivity |
Tensile Strength |
| g/cm3 |
10-6K |
W/M.K |
Mpa |
| CPC141 |
Cu/Mo70Cu/Cu |
9.5 |
7.3/10.0/8.5 |
220 |
380 |
| CPC131 |
Cu/Mo70Cu/Cu |
|
|
|
|
| CPC121 |
Cu/Mo70Cu/Cu |
|
|
|
|
| CPC232 |
Cu/Mo70Cu/Cu |
9.3 |
7.5/11.0/9.0 |
255 |
350 |
| CPC111 |
Cu/Mo70Cu/Cu |
9.2 |
9.5 |
260 |
310 |
| CPC212 |
Cu/Mo70Cu/Cu |
9.1 |
11.5 |
300 |
230 |
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