Copper Molybdenum Heat Sink Material for Electronic Packaging Mocu Alloy

• Customization: Available
• Application: Electronics, Industrial
• Standard: GB, ASTM, AISI
• Model NO.: Customized
• Purity: 70-90
• Alloy: Alloy
• Type: Molybdenum Alloy
• Powder: Not Powder
• Surface Condition: Polished
• Density: 9.5-10.5 G/Cm³
• Thermal Conductivity: 190-240 W/(M·K)
• Cte: 6-8.5 Ppm/°C
• Transport Package: Plywood Boxes
• Specification: Customized
• Trademark: FOTMA
• Origin: P. R. China
• HS Code: 81019990
• Production Capacity: 10t/Year

Product Description

Product Description

FOTMA Molybdenum Copper Alloy (MoCu) Heat Sink Alloy: Lightweight, Ultra-Dense, and Precision-Cooling for Electronics & Defense
Lightweight Yet Ultra-Dense, Engineered for Efficient Thermal Dissipation FOTMA molybdenum copper (MoCu) alloy achieves near-100% density, nanocrystal line structure (grain size ≤5μm) , and exceptional leak-tightness (helium leak rate <5×10^-9 Pa·m³/s), surpassing traditional thermal management materials. Compared to tungsten-copper (WCu), MoCu boasts 30% lower density, superior rollability, and stamping compatibility, making it ideal for mass production of ultra-thin heat sinks.

Breakthrough Advantages of Molybdenum Copper

1. Ultra-Dense Structure & Hermetic Reliability

• Vacuum Hot Pressing + HIP Sintering: Density ≥99.8%, near-zero porosity, and thermal conductivity up to 190-240 W/(m·K) , matching leading global competitors.
• Atomic-Level Sealing: Helium leak rate <5×10^-9 Pa·m³/s, meeting aerospace-grade hermeticity standards to prevent oxidation failure in microelectronics.

1. Lightweight & Cost-Effective Manufacturing

• Density: 9.5-10.5 g/cm³ (vs. WCu ≥14 g/cm³): Reduces component weight for 5G mobile devices, drones, and other weight-sensitive applications.
• Exceptional Rollability: Rolled into ultra-thin foils down to 0.05mm (30% thinner than WCu), ideal for chip-scale vapor chambers.
• High-Precision Stamping: Enables complex-shaped heat sink parts at 40% lower mass-production costs and 50% faster lead times.

1. High-Temperature Stability & Extended Lifespan

• Creep Resistance at 800°C: Maintains >85% strength retention for high-power laser mounts and military radar T/R module cooling.
• Low CTE (6.0-8.5×10^-6/°C): Matches GaN/SiC chips, reducing thermal stress by 70% in power electronics.

 

Product Parameters

Key Applications of Our Copper Moly Material

Industry	Challenges	FOTMA MoCu Solutions
Microelectronics	5G RF module overheating, sealing failures	0.1mm ultra-thin MoCu vapor chambers (240 W/m·K thermal conductivity) with 100% helium leak compliance.
Defense Cooling	Hypersonic vehicle transpiration cooling under thermal shock	Custom gradient-porous MoCu structures withstand 2000°C transient heat, tripling cooling efficiency.
Electrode Manufacturing	Short electrode lifespan in resistance welding	Mo70Cu30 electrodes last 5x longer than pure copper, maintaining 85% IACS conductivity.
Consumer Electronics	Lightweight cooling for smartphones/AR devices	Stamped heat spreaders: 40% lighter, 0.3mm thickness, enabling slim designs.

 

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